RESEARCH ARTICLE
New Metalized Polyimide Films Structure and Physical Properties
Saule K. Kudaikulova1, 5, Rinat Iskakov1, Elena Vecherkina1, 5, Bulat A. Zhubanov1, Oleg Prikhodko2, Andrey Kurbatov2, Tleuken Akhmetov2, Sergey Bazhenov3, Irina Razumovskaya3, Alain Perichaud4, Vanda Yu. Voytekunas5, 6, Vitali Lipik5, 7, Marc J.M. Abadie*, 5, 7
Article Information
Identifiers and Pagination:
Year: 2008Volume: 2
First Page: 66
Last Page: 72
Publisher ID: TOCENGJ-2-66
DOI: 10.2174/1874123100802010066
Article History:
Received Date: 13/02/2008Revision Received Date: 06/03/2008
Acceptance Date: 25/03/2008
Electronic publication date: 7/4/2008
Collection year: 2008
open-access license: This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 International Public License (CC-BY 4.0), a copy of which is available at: https://creativecommons.org/licenses/by/4.0/legalcode. This license permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
Abstract
The classical techniques of PI film metallization by either vapour deposition or electrochemical reduction of metals involve necessary technological steps such as polymer surface modification via plasma or ion beam, electron beam, or photolytic treatment, or surface sensitization by the conferment of catalytic properties, in order to enhance metal- PI adhesion, which is the main problem to be overcome in all processes.
The technology presented differs by the use of another chemical approach yielding electro-conductive materials with high reflectivity, but without damaging the films in the process. The metalized polyimide films have been prepared by heterogeneous chemical modification of the polyimide surface and the suggested technology includes several chemical conversion steps (hydrolysis, chelating by metal salts and reduction) requiring no complicated procedures and proceeding under mild conditions, at room temperature and without aggressive agents. This new process allows the formulation of metal phase while both simplifying the technology and making use of commercial PI films, such as Kapton®HN and Upilex®S.
In memoriam of Dr. Saule K. Kudaikulova