RESEARCH ARTICLE


New Metalized Polyimide Films Structure and Physical Properties



Saule K. Kudaikulova1, 5, Rinat Iskakov1, Elena Vecherkina1, 5, Bulat A. Zhubanov1, Oleg Prikhodko2, Andrey Kurbatov2, Tleuken Akhmetov2, Sergey Bazhenov3, Irina Razumovskaya3, Alain Perichaud4, Vanda Yu. Voytekunas5, 6, Vitali Lipik5, 7, Marc J.M. Abadie*, 5, 7
1 Institute of Chemical Sciences – ICS of Kazakh Academy of Science, 106 Valihanov, 480100 Alma-Ata, Republic of Kazakhstan
2 el-Farabi Kazakh National University, 96 Karasay Batyr, 480012, Almaty, Republic of Kazakhstan
3 Russian State Pedagogical University, 2M. Pirogovskaya Street, Moscow, Russia
4 University of Provence Aix-Marseille, 3 Place Victor Hugo, 13331 Marseille, France
5 Laboratory of Polymer Science & Advanced Organic Materials - LEMP/MAO, University Montpellier II, Place Bataillon, 34095 Montpellier Cedex 05, France
6 Singapore Institute of Manufacturing Technology - SIMTech, 71 Nanyang Drive, 638075, Singapore
7 School of Materials Science and Engineering, Nanyang Technological University – NTU, 50 Nanyang Avenue, 639798, Singapore


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© 2008 Kudaikulova et al.

open-access license: This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 International Public License (CC-BY 4.0), a copy of which is available at: https://creativecommons.org/licenses/by/4.0/legalcode. This license permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.

* Address correspondence to this author at the School of Materials Science and Engineering, Nanyang Technological University – NTU, 50 Nanyang Avenue, 639798, Singapore; E-mail: marc@ntu.edu.sg
Laboratory of Polymer Science & Advanced Organic Materials - LEMP/MAO, University Montpellier II, Place Bataillon, 34095 Montpellier Cedex 05, France; E-mail: abadie@univ-montp2.fr


Abstract

The classical techniques of PI film metallization by either vapour deposition or electrochemical reduction of metals involve necessary technological steps such as polymer surface modification via plasma or ion beam, electron beam, or photolytic treatment, or surface sensitization by the conferment of catalytic properties, in order to enhance metal- PI adhesion, which is the main problem to be overcome in all processes.

The technology presented differs by the use of another chemical approach yielding electro-conductive materials with high reflectivity, but without damaging the films in the process. The metalized polyimide films have been prepared by heterogeneous chemical modification of the polyimide surface and the suggested technology includes several chemical conversion steps (hydrolysis, chelating by metal salts and reduction) requiring no complicated procedures and proceeding under mild conditions, at room temperature and without aggressive agents. This new process allows the formulation of metal phase while both simplifying the technology and making use of commercial PI films, such as Kapton®HN and Upilex®S.

In memoriam of Dr. Saule K. Kudaikulova